Vodafone, Orange partner for FTTH in Spain
Week News Abstract For Fiber Series in 10GTEK
The abstract is mainly about the optical communication related products,including: SFP,QSFP,FTTH,GPON,EPON,SFPPLC,PTN,ODN,Sfp Transceiver,Optic Transceiver,Optical module,Optical devices,optical communications,Optical transceiver module,Etc.
Oclaro unveils customizable add/drop routing platform
Oclaro, Inc. (NASDAQ: OCLR) has introduced a new Add/Drop Routing Platform with a wide range of functions that customers can choose from to design their next-generation multi-degree, colorless, directionless, contentionless, and flexible-grid (CDC-Flex) ROADM networks for carrying channels at 100 Gbps and higher.The new Oclaro platform, which features technologies such as switching, arrayed amplification, advanced control, and monitoring, can be offered either as a line card, a managed subsystem, or a “super module.” This platform enables customers to include or trade off specific functions to meet their performance and time-to-market requirements when designing next-generation ROADM networks. This new platform also offers improved density and cost-efficiencies for a wide range of configurations while meeting the performance requirements of next-generation fiber-optic networks, Oclaro claims.The new Add/Drop Routing Platform encompasses a wide range of features and functions that customers need to future-proof their next-generation networks. Key components include:Highly integrated cost- and space-efficient amplified multi-cast switches with variable optical attenuation (VOA) functionality for CDC-Flex add/drop routing in multi-degree ROADM architectures.Advanced arrayed optical amplifier implementations leveraging Oclaro’s 980-nm pump portfolio that now also includes Oclaro’s uncooled dual-chip pumps. These pumps offer power reduction and enable cost-effective high-density designs, the company asserts.Multi-port flexible-grid optical channel monitor (OCM) that rapidly measures channel powers and frequencies of eight DWDM input ports with the accuracy needed for flexible-grid network applications. The OCM offers enhanced flexibility and incorporates features such as port or channel dwelling and prioritization for signal analysis.Embedded control features to provide fast transient management and advanced signal processing capabilities to support the network intelligence required by next-generation networks while also meeting stringent space and power constraints. This platform builds on field-proven control architectures to enable rapid and reliable development of highly integrated add/drop routing functionality, Oclaro asserts.A typical add/drop application using the products would be targeted at four- or eight-degree CDC-Flex node architectures with each unit (whether a line card, a managed subsystem, or a super module) supporting up to 16 transponders per card. The right form factors (including single-slot) are achieved through a high degree of integration and controller consolidation, which also lowers cost. Such low density is a highly desirable feature for next-generation multi-terabit network equipment.“The flexibility of the add/drop routing platform enables customers to specify customized subsystems that can meet their cost, density and time-to-market requirements while giving them the freedom to create truly differentiated network solutions,” said Per Hansen, vice-president of product marketing, optical networks solutions, Oclaro. “Leveraging Oclaro’s recognized strengths in vertical integration combined with a broad set of optical networking components and subsystems, this new platform essentially assembles leading-edge functionalities into a highly integrated and compact platform solution.”
Vodafone, Orange partner for FTTH in Spain
Vodafone Spain and Orange have agreed to co-invest in deploying fiber to the home (FTTH) networks in Spain. The resulting fiber-optic networks will reach 6 million premises in 50 cities by September 2017 at a price of €1 billion, the carriers assert.Vodafone and Orange will each deploy fiber to the premises (FTTP) infrastructure in different, complementary areas. Each company will own the fiber it deploys, but the networks will have the same technical specifications to enable them to operate as a single network, to which both partners will have full access. The companies also will install their own in-building fiber, to which the other is also guaranteed access.Vodafone and Orange expect to begin offering commercial services on the initial parts of the network in January 2014. They expect to reach 800,000 households and workplaces by March 2014, 3 million households and workplaces by September 2015, and 6 million households and workplaces by 2017. This equates to a residential penetration level of around 40%.The carriers say they are open to adding other co-investors. Meanwhile, they also say they will collaborate with regulators to ensure sharing of vertical infrastructure at prices based on actual cost, effective access to Telefónica’s ducts, and the timely acquisition of all necessary permits.“I am delighted to announce our plans to work with Orange to deploy fiber networks across Spain,” said Vodafone Chief Executive for the Southern Europe Region Paolo Bertoluzzo. “This agreement demonstrates Vodafone’s commitment to provide high-speed unified communications services to our customers coupled with our willingness to invest when there are positive returns.”
OneChip Photonics offers PIC-based 100G components for data center interconnects
OneChip Photonics has unveiled a new family of photonic integrated circuit (PIC)-based 100-Gbps devices for optical interconnect applications, particularly those in the data center. The company asserts that its PIC-based approach is superior to alternative technologies, including those based on silicon photonics.The company is targeting the new devices at optical transceiver vendors who wish to shrink 100-Gbps capabilities into a QSFP form factor. The products leverage OneChip’s indium phosphide-based Multi-Guide Vertical Integration (MGVI) process, which creates multifunction devices using a single epitaxial growth step. The process requires no post-growth epitaxial processing as well.The PIC approach provides significant advantages in terms of cost, power consumption, and manufacturing complexity versus the use of discrete devices, OneChip says. The company also says that MGVI is superior to silicon photonics approaches. Because of the difficulty in lasing and detecting at the 1300-nm spectral range that the OneChip devices target, silicon photonics approaches require the bonding III-V semiconductors (for lasing) and epitaxial overgrowth of germanium (for detection). This makes it difficult for silicon photonics devices to be manufactured simply using standard CMOS processes, the company asserts. (But silicon photonic technology developers would likely quibble with this assumption and its implications; see, for example, “Skorpios demos CMOS tunable laser, nears production.”)The extensive line of 100G products includes: 100GbE LR4 WDM iRx (4x25G integrated receiver), with an 802.3ba-compliant single-chip design, four-PIN photodiode with integrated WDM and spot-size converter (SSC), which is available for testing now 100GbE PSM4 iRx (4x25G parallel singlemode), with a parallel fiber single-chip design, four-PIN photodiode, available for testing now 100GbE PSM4 iTx (4x25G parallel single mode), also with a parallel fiber single-chip design, one DFB laser split into four electro-absorption modulators (EAMs), each followed by an SSC, available for testing Q2 2013 100GE LR4 iTx (4x25G integrated transmitters), with an 802.3ba-compliant single-chip design, four DFB lasers, four EAMs with integrated WDM and SSC, available for testing Q4 2013.The company also offers a pair of 40G PICs:40GbE LR4 iRx (4x10G integrated receiver), with an 802.3ba-compliant design, PIN photodiode with integrated WDM and SSC, available for testing now 40GbE LR4 iTx (4x10G integrated transmitters), with an 802.3ba-compliant design; 10G DML with SSC, available for testing Q2 2013.OneChip also is developing PIC-based 100GbE PSM4 Transmitter-Receiver Optical Sub-Assemblies (TROSAs) for data center interconnect applications.The company says it is working with partners to optimally package these PICs for specific applications. Meanwhile it has established relationships with Global Communication Semiconductors for InP wafer processing services and IQE to grow its epitaxial structures.
The above information is edited by 10GTEK.
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